The Global Silver Sintering Paste Market size was estimated at USD 63.90 million in 2021 and is expected to hit around USD 104.02 million by 2030, poised to grow at a compound annual growth rate (CAGR) of 6.52 % from 2022 to 2030.
Global Silver Sintering Paste Market: Breakup by Region, 2022 & 2031
Source: Primary Research and Secondary Research Analysis
Silver sintering paste is a conductive material used in electronics and semiconductor manufacturing as a bonding agent to join two surfaces. It is a type of adhesive paste made from silver particles that are mixed with a polymer binder and solvent. The paste is applied to the surfaces of the components to be bonded, and then heated to a high temperature, typically around 300-400°C, to activate the sintering process. During sintering, the silver particles fuse together to form a solid, metallic bond between the surfaces.
Silver sintering paste is a popular choice for bonding applications in high-power electronics, such as power modules, hybrid electric vehicles, and renewable energy systems. It offers several advantages over traditional bonding methods, such as soldering and epoxy adhesives. For example, silver sintering paste provides a higher thermal conductivity and better thermal stability, which makes it ideal for use in high-temperature applications. It also offers improved electrical conductivity and higher mechanical strength, which enhances the overall performance and reliability of the bonded components.
In addition, silver sintering paste is a more environmentally friendly alternative to traditional bonding methods that use lead-based solders or hazardous chemicals. It is also compatible with a wide range of substrates, including silicon, silicon carbide, and gallium nitride, which makes it suitable for use in various semiconductor and electronic applications.
It is a form of a highly silver-filled die-attached paste known as silver sintering paste that has the likely to make extraordinarily high thermal conductivity. Silver-sintered pastes, a potent lead-free substitute to solder pastes, can extend the gadget’s lifespan by up to 10 times. Higher thermal conductivity in the lead frame and LED packaging applications may be ensured by using it for printing or also the dispensing operations.
The heat is applied to a silver paste during the process of densifying it is identified as silver sintering paste. Several simultaneous processes, including densification, pore expansion, and grain growth, result in a more vital link inside the material. Because of the superior quality of these goods, which are appropriate for quick silver sintering operations on various surfaces and exhibit decreased metallization. These pastes have a high metal loading and are made to readily integrate into a dispensing process without modifying the deposition apparatus. The pastes will firmly adhere to the die with Ag, Au, or Cu surfaces and may be used in rapid reflow-like (RFL) sintering processes to generate strong joints on various standard lead frames, DBC, and IPM pad finishes.
Global Silver Sintering Paste Market Research Report, 2020-2031.
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Global Silver Sintering Paste Market Research Report, 2020-2031.
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